SMT Assembly Service
SMT assembly (Surface Mount Technology assembly, or PCBA) is the process of directly mounting surface-mount devices (SMDs—such as resistors, capacitors, chips, and BGAs) onto the pads of a PCB and then soldering them via reflow soldering to create a fully functional circuit board.
We support SMT assembly for rigid PCB, flexible FPC and rigid-flex PCB. Whether you are developing consumer electronics, industrial control, IoT, automotive or medical devices, we deliver reliable PCBA service from quick prototypes to volume manufacturing. Strict quality control is implemented throughout the whole SMT process.
Key Points:
- No drilling required: Component leads or terminations are mounted directly onto the surface, eliminating the need for through-holes (unlike THT).
- Three core processes: Solder paste printing → Component placement (pick-and-place machine) → Reflow soldering.
- Soldering mechanism: After solder paste printing, reflow soldering applies heat to melt the paste, bonding the components to the pads.
- Supported components: Ranges from tiny chip resistors and capacitors to high-density packages such as BGA and QFN.
- Advantages: Compact size, high component density, suitability for double-sided mounting, and compatibility with high-volume automated production.
Fundamental difference from THT (Through-Hole Technology): SMT involves surface mounting and soldering without through-holes, whereas THT involves inserting leads through holes for soldering.
SMT Assembly Specifications
✅ Component Range: 01005, 0201, 0402, 0603, 0805; QFN, QFP, BGA, CSP, Connector
✅ Minimum Component Pitch: 0.3mm
✅ PCB Thickness: 0.2mm – 4.0mm
✅ PCB Size: Min 5mm × 5mm, Max 1200mm × 600mm
✅ Assembly Side: Single-sided SMT, Double-sided SMT
✅ Volume Support: Prototyping, Small batch & Mass production
✅ Post Assembly Test: AOI inspection, X-ray inspection for BGA, Functional Test(FCT)
✅ File Required: Gerber files, BOM list, Centroid file
Our SMT Production Workflow
- 1. Gerber & BOM Review: Our engineering team validates your design files, checks component availability and gives DFM feedback before production.
- 2. Solder Paste Printing: Precise stencil printing applies consistent solder paste on PCB pads.
- 3. Pick & Place: High-speed placement machines mount SMD components onto PCBs accurately.
- 4. Reflow Soldering: Controlled temperature reflow oven melts solder paste to form reliable solder joints.
- 5. Inspection: AOI automatically checks soldering defects; X-ray inspection is available for BGA hidden solder joints.
- 6. Functional Testing (FCT): Custom electrical test to verify board function according to your test specification.
- 7. Packing & Delivery: Anti-static packaging for safe shipment.
Our SMT Assembly Advantages
High-Density Component Placement
Our precision SMT placement equipment supports ultra-small 0201 chips, BGA and QFN packages. We populate more components on a single PCB to develop sophisticated, space-saving circuits tailored to your electronic projects.
Compact & Miniaturized Layout
Compared with THT through-hole assembly, SMD components occupy minimal PCB real estate. It enables slim, lightweight hardware designs for portable, wearable and space-constrained electronic products.
Excellent High-Frequency Signal Performance
SMT shortens interconnect paths to reduce parasitic inductance and capacitance. It suppresses signal noise and crosstalk, delivering stable performance for high-speed and high-frequency circuit applications.
Fully Automated Consistent Production
High-speed pick-and-place machines combined with reflow soldering provide stable, repeatable assembly quality. We handle prototype samples, small trial batches and large-volume mass production orders.
Cost-Effective Volume Manufacturing
Automated workflows cut manual labor costs. The reduced PCB footprint also conserves substrate material, lowering overall project expenditure for bulk manufacturing.
Frequently Asked Questions
Q: What files do I need to start SMT assembly?
A: Gerber files, BOM list, Pick & Place (Centroid) file are required. We also accept schematic and PDF datasheets for reference.
Q: Can you source electronic components for my PCBA project?
A: Yes, we provide full component sourcing service. We source genuine parts for prototype and mass orders, and offer alternative component suggestions if parts are out of stock.
Q: Do you support mixed SMT + THT assembly?
A: Sure. We support hybrid assembly: SMT on PCB surface plus DIP through-hole soldering in one order.
Q: What is your lead time for SMT prototype?
A: Typical prototype lead time: 3–7 working days, mass production lead time depends on order quantity and component availability.
Q: What inspection methods do you use for SMT boards?
A: Standard AOI inspection for all SMT orders. X-ray inspection is optional for BGA, CSP and fine pitch ICs.