Our Custom FPC Flat Cable, Black PI with Chip & Connector is a light-shielding flexible interconnection cable integrated with chip pads and connector contacts for optical and miniature electronic devices.
Core Points
🟢 Black PI polyimide substrate, excellent light shielding performance, suppress optical interference for camera & sensor modules
🟢 Integrated design: FPC flat cable + chip mounting area + pre-soldered connector, one-piece assembly, reduce assembly steps
🟢 Ultra-thin, lightweight and bendable, support repeated dynamic bending, save internal space of compact devices
🟢 Stable electrical performance, low signal attenuation, good for high-speed LVDS / MIPI signal transmission
🟢 Customizable length, pin count, pitch, chip pad layout and connector direction
🟢 Optional stiffener on SMT and connector zone, prevent warping during soldering
🟢 100% open-short testing before shipment, support prototype sampling and mass OEM
🟢 RoHS & REACH compliant, widely used for camera, display, biometric and wearable devices
Product Overview
Our Custom FPC Flat Cable with Black PI film is an integrated flexible interconnection solution, combining black PI shielding FPC circuit, chip mounting pads and FFC/FPC connector on a single flex circuit. Black PI material blocks stray light leakage, which is critical for image sensor and optical modules. Compared with separate FPC cable + discrete chip + connector assembly, this integrated design cuts assembly labor, reduces contact failure points and makes the internal structure of end products more compact. We support fully customized layout according to your Gerber, including chip footprint, connector pin definition, bending area and shielding requirements.
Technical Specification Table
| Item | Specification |
|---|---|
| Base Material | Black Polyimide (Black PI), 12.5μm / 25μm / 50μm |
| Adhesive | Acrylic adhesive / Adhesive-free PI (high bending version) |
| Copper Foil | RA Rolled Annealed Copper, 0.33oz / 0.5oz |
| Layer | Single-sided / Double-sided FPC |
| Min Line / Space | 3mil / 3mil |
| Pitch Option | 0.3mm, 0.5mm, 1.0mm |
| Connector Type | FFC / FPC connector, top contact / bottom contact |
| Chip Pad Area | Custom footprint for IC, sensor chip |
| Stiffener | FR4 / PI stiffener optional on chip & connector region |
| Surface Finish | Immersion Gold, OSP, Immersion Tin |
| Bend Radius | ≥0.8mm |
| Bending Cycle | Up to 100,000 cycles (adhesive-free black PI) |
| Operating Temperature | -40℃ ~ +125℃ |
| Standard | IPC-4204, RoHS, REACH |
Performance Characteristics
- Light blocking property: Black PI blocks ambient stray light, avoid flare and noise for CMOS image sensors
- Excellent flex durability: RA copper matched with ductile black PI film, stable after thousands of bending cycles
- Integrated signal path: Continuous traces from chip pads to connector, less signal loss and interference
- Low outgassing: Black PI material with stable formula, suitable for optical precision modules
- Good insulation & moisture resistance: Prevent short circuit in humid enclosed device environment
- Custom shielding upgrade: Can add copper shield layer + coverlay for EMI suppression on request
Manufacturing & Process Advantages
- Special black PI lamination process, uniform color, no light leakage spot, consistent shading effect
- LDI precision exposure & etching for fine traces, accurate chip pad dimension for SMT
- Laser coverlay opening, clean pad window for chip soldering and connector contact fingers
- Automatic stiffener bonding, no offset and bubble on SMT zone
- We can pre-solder the connector for you, and reserve chip pads for your SMT
- DFM review before production: check bending area, chip stress and trace routing to avoid fracture risk
- AOI + 100% electrical testing, detect open/short circuit before delivery
Typical Application Scenarios
- CMOS camera module, notebook / tablet internal camera
- Fingerprint biometric sensor, optical recognition module
- Small OLED / LCD display interconnection
- Wearable smart devices, smart watch sensor link
- Industrial miniature optical detection equipment
- Endoscope, portable imaging module
