Our Polyimide Flex PCB with FFC connectors is a compact flexible interconnection solution built for narrow-space electronic signal transmission.
🟢 Core Selling Points
- Integrated FPC + FFC connector design, one-piece flexible interconnect solution, no extra wiring, saves assembly space and labor cost
- Polyimide (PI) base material, outstanding bending & folding endurance, supports dynamic repeated flexing
- Fully customizable: trace layout, pin count, length, width, thickness, connector direction (top/bottom contact)
- Stable electrical performance, low signal crosstalk, good for high-speed signal transmission
- Support prototype sampling and bulk OEM production, Gerber & drawing customization
- RoHS / REACH compliant, available for industrial, display, medical, camera and consumer electronics
- Optional stiffener on soldering area, easy SMT soldering, prevent pads lifting during assembly
- Multiple surface finishes: OSP, immersion gold, immersion tin for different soldering requirement
🟢Specification Table
| Item | Specification |
|---|---|
| Base Material | Polyimide (PI), 12.5μm / 25μm / 50μm PI film |
| Adhesive | Acrylic adhesive / Adhesive-free PI (high reliability version) |
| Layer Type | Single-sided FPC, Double-sided FPC |
| Copper Foil | Rolled annealed copper (RA copper), 1oz / 0.5oz / 0.33oz |
| Min Line / Space | 3mil / 3mil |
| Min Pad Size | 0.2mm |
| FFC Connector Type | Top contact / Bottom contact, 0.3mm / 0.5mm / 1.0mm pitch |
| Pin Count | 4Pin ~ 80Pin custom |
| Bend Radius | ≥ 0.8mm (depends on FPC thickness) |
| Stiffener | PI stiffener / FR4 stiffener optional |
| Surface Finish | OSP, Immersion Gold, Immersion Tin, Immersion Silver |
| Coverlay | Polyimide coverlay, custom opening for pads |
| Operating Temp | -40℃ ~ +125℃ |
| Standard | IPC-4204, RoHS, REACH |
🟢 Design Principle
This flex circuit adopts Polyimide as dielectric substrate, which has high flexibility and heat resistance. We design the FPC tail to match FFC connector pitch precisely; copper traces route signals from contact fingers to component pads. Coverlay protects copper circuits from oxidation, dust and short circuit. Stiffener is added on connector soldering region to increase local rigidity, solving the problem that thin FPC is too soft for connector soldering. The whole structure replaces discrete wire harness + separate FFC cable, realizes compact interconnection in narrow space. Differential pair routing can be applied if high-speed LVDS / USB signal transmission is required.
🟢Performance Characteristics
- Excellent flexibility, capable of static bending and dynamic cyclic bending (up to tens of thousands bending cycles)
- PI material with low moisture absorption, stable insulation property in humid environment
- Good heat resistance, withstand SMT reflow temperature without bubbling or delamination
- Lightweight & ultra-thin, greatly reduce product thickness and weight compared with traditional wire harness
- Consistent impedance performance for high-speed signal, reduce signal attenuation and interference
- Vibration resistant, less loose contact failure than discrete wiring harness
🟢 Manufacturing & Process Advantages
- Precision exposure & etching process, guarantee uniform trace width and accurate FFC finger pitch
- Coverlay alignment precision control, clean opening for connector contact fingers
- Automatic stiffener bonding, no offset & bubble, flat soldering area for FFC connector
- Strict peel strength test for copper and coverlay, avoid peeling off after repeated bending
- Electrical open/short testing 100% before shipment
- Support pre-soldering FFC connector as one finished assembly for customers
- DFM review before production, check bend area, finger layout and stiffener position to avoid design risk
🟢Typical Application Scenarios
- LCD / OLED display screen connection
- Camera module, notebook, tablet internal interconnection
- Medical wearable devices, sensor modules
- Industrial control panel, test equipment
- Smart home, small consumer electronics
- LVDS high-speed signal transmission link
We provide full DFM checking before production to optimize bend radius, finger layout and stiffener position, helping you avoid common design pitfalls of flex circuits. Every batch undergoes 100% open-short electrical test to guarantee stable performance for your end products. We support both small-batch prototype sampling and mass volume orders for worldwide industrial and medical customers.
