Volectronics manufactures custom metal base PCBs engineered for automotive power control systems. Built on an aluminum base (6061/5052) with a high-thermal-conductivity dielectric layer (1–9 W/m·K) and thick copper (1–4 oz), these boards rapidly conduct heat away from power components, lower device operating temperatures, and extend system life under harsh automotive conditions.
Key Specifications
| Item | Typical Value |
|---|---|
| Base Material | Aluminum 6061/5052, 0.8–3.2 mm, anodized |
| Thermal Interface | 1–9 W/m·K (high-thermal grade) |
| Dielectric Layer | 50–150μm (thin for low thermal resistance) |
| Copper Thickness | 1–4 oz (thick for high current) |
| Board Thickness | 1.0–3.2 mm |
| Dielectric Withstand | AC 1500–2500V |
| Thermal Resistance Rth | 0.5–5 K·cm²/W |
| Operating Temp. | −40 ~ +150°C |
| Min Trace/Space | 10/10–8/8 mil |
| Surface Finish | ENIG / HASL / OSP |
| Solder Mask | White (reflective) / Black / Green LPI |
Solder Mask
- Commonly uses white solder mask (for reflective or LED applications) or black/green solder mask.
- Features uniform thickness, high dielectric strength, and resistance to moisture and scratches.
- Precise solder mask openings; vias are covered or plugged to prevent moisture ingress.
- For high-thermal-conductivity applications, heat-resistant solder mask is selected to prevent cracking.
Manufacturing Advantages
- High Thermal Conductivity: Aluminum base boards have a thermal conductivity of approximately 150 W/m·K, far exceeding that of FR4 (0.2–0.4).
- Low Thermal Resistance: A combination of a thin insulation layer and high thermal conductivity enables rapid vertical heat dissipation.
- High Current Carrying Capacity: Thickened copper (1–4 oz) makes them suitable for high-current automotive power applications.
- High Mechanical Strength: Aluminum boards offer resistance to vibration and warping, making them ideal for harsh automotive environments.
- Inherent Shielding: The aluminum board acts as a reference ground or shield, suppressing EMI.
- Anodization: An anti-corrosion treatment that ensures suitability for humid or corrosive automotive environments.
Technical Features
- Three-layer structure: Copper circuit layer + thermally conductive insulating layer + aluminum base plate.
- Shortest thermal path: Power component pads are bonded directly to the thermal layer, conducting heat vertically into the aluminum plate.
- Single-sided circuitry: The aluminum plate serves as the metal substrate; there are no through-holes penetrating the base plate (preventing short circuits).
- Thermal isolation/zoning: Heat-generating areas are thermally isolated from other regions to prevent thermal crosstalk.
- Thick copper traces: Reduces I²R self-heating; high-current paths are widened.
- DFM (Design for Manufacturability): Thermal expansion matching with the aluminum plate, void-free lamination, and delamination prevention.
VolectronicsTech Co., Ltd was established in 2017 and is dedicated to providing one -stop services for orders ranging fromprototyping and small-to-medium batch production to large-scale mass production.
We offer a diverse selection of PCB material, including FR4, Rogers, Metal based, TU, Isola, PI, and other high-frequency material, providing a wide range of options to meet your specific requirements.Welcome to contact us!
