I. Key Specifications and Parameters
- Thermally conductive insulating layer: 1–9 W/m·K; thickness: 50–150 μm (thinner = lower thermal resistance).
- Aluminum base plate: 0.8–3.2 mm; 6061/5052 alloy; anodized for corrosion resistance.
- Copper thickness: 1–4 oz; capable of carrying high currents.
- Withstand voltage: AC 1500–2500 V; thermal resistance: 0.5–5 K·cm²/W.
- Operating temperature: −40 to +150°C; solder mask typically white (reflective) or black.
II. Design Principles
- The LED thermal pad is mounted directly onto the thermal conduction layer, allowing heat to be conducted vertically into the aluminum substrate.
- Thermal isolation/partitioning: Thermally isolates the high-heat LED zone from the control circuitry to prevent lateral heat transfer from causing circuit overheating.
- Thick, extensive copper pours reduce I²R self-heating; an external heatsink is attached to the aluminum substrate.
III. Signal performance characteristics
- Single-sided conductive layer with an aluminum reference ground; suitable for low-frequency/power signals (e.g., LED constant current, PWM dimming).
- High dielectric loss; not suitable for high-frequency or high-speed applications.
IV. Key Points for Design and Manufacturing
- The insulation layer is laminated to the aluminum plate with strong adhesion and no air bubbles.
- Thermal isolation grooves and zonal structures are optimized based on thermal simulations.
- The aluminum plate features an anti-corrosion anodized finish; there are no through-holes extending to the base plate (preventing short circuits).
- Actual heat dissipation performance is verified through thermal resistance testing.
V. Application Areas
Volectronics Tech Co., Ltd was established in 2017 and is dedicated to providing one -stop services for orders ranging fromprototyping and small-to-medium batch production to large-scale mass production




