Our Metal core aluminum base MCPCB is designed for LED light strip applications.
Aluminum Base MCPCB, also known as metal core PCB, is specially designed for LED light strips with superior heat dissipation performance.
Our Aluminum Base MCPCB uses aluminum substrate as the core material to rapidly transfer heat generated by LED chips, lowering working temperature and extending LED service life. We support customized circuit layout, copper weight, solder mask color and surface finishes including HASL, OSP and ENIG. Volectronics Tech Co., Ltd manufactures high-quality metal core MCPCB for LED lighting, smart home lighting and industrial illumination systems. We provide fast quotation and reliable one-stop PCB fabrication service.
Specifications
- Base Material: Aluminum alloy 1050 / 1060 / 5052
- Aluminum Core Thickness: 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm
- Dielectric Layer Thickness: 75μm / 100μm / 150μm (thermal conductive insulation layer)
- Copper Foil: 1oz (35μm), 2oz (70μm), 3oz (105μm) rolled copper
- Layers: Single-sided MCPCB (standard for LED strip), double-sided MCPCB optional
- Min Line Width / Space: 0.15mm / 0.15mm
- Min Hole Size: 0.2mm
- Surface Finish: OSP, Immersion Gold, Immersion Silver, HASL Lead-free
- Thermal Conductivity: 1.0 W/m·K, 2.0 W/m·K, 3.0 W/m·K (customizable)
Performance Characteristics
- Excellent Thermal Dissipation: Aluminum metal core transfers LED heat rapidly, avoid heat accumulation. Lower LED junction temperature, improve luminous efficiency and lifespan.
- Mechanical Strength: High rigidity, shock resistance, not easy to deform. Good flatness for LED SMT mounting.
- Light Weight: Lighter than copper core PCB, easy for long LED strip assembly.
- Thermal Expansion Matching: Low thermal expansion coefficient, reduce the risk of copper trace cracking under repeated temperature cycling.
- Environment Friendly: RoHS compliant, suitable for indoor & outdoor lighting.
Design Principle
- Stack-up Structure: 3-layer structure: Copper trace layer → thermally conductive dielectric insulation layer → aluminum metal base. The dielectric layer isolates circuit and aluminum substrate while conducting heat.
- Thermal Path Design: Place LED pads directly above the thermal conductive dielectric zone, shorten heat transfer path from LED chip to aluminum base.
- Trace Layout: Wider copper traces for high current LED circuits. Keep high-power traces away from sensitive small components.
- Thermal Pad Design: Large thermal pad under LED chips, maximize heat conduction area.
- Shape Customization: Can be made in long strip, curved, irregular shape to fit various LED light bar profiles.
Solder Mask Properties
- Solder Mask Type: Liquid photoimageable green / black / white solder mask (white is preferred for LED strips to boost light reflectivity)
- White Solder Mask: High reflectivity (>85%), reduces light absorption and improves LED luminous output
- Solder Mask Adhesion: Strong bonding on copper and dielectric layer, no peeling during SMT reflow
- Heat Resistance: Withstand lead-free reflow temperature up to 260℃, no yellowing, blistering or delamination
- Insulation Property: Solder mask provides electrical isolation between traces, anti-oxidation, anti-scratch, anti-moisture protection
Signal & Electrical Performance
- Working Voltage: Up to 48V DC (common for LED strip)
- Withstand Voltage: ≥2kV AC between copper circuit and aluminum base
- Insulation Resistance: ≥10⁹ Ω at DC 500V
- Current Carrying Capacity: Depends on copper weight and trace width; support high current for high power LED arrays
- Low leakage current: Stable insulation performance under continuous heating
- Note: Aluminum MCPCB for LED strips mostly used for power distribution, not high-speed signal transmission; not suitable for controlled impedance signal circuits.




