Product Overview
1.6mm Double-sided Thermoelectric Separation Aluminum PCB is a special aluminum base circuit board with thermoelectric separation structure, board thickness fixed at 1.6mm. It adopts an insulating isolation design to separate the thermal conduction path and electrical circuit path independently on both sides of the aluminum substrate.
The aluminum core provides fast heat dissipation channel, while the circuit traces are electrically isolated from the aluminum heat sink. It avoids short-circuit risks caused by direct contact between power circuit and metal heat carrier. Double-sided layout allows more component placement space, suitable for high-power devices that require both efficient heat dissipation and electrical insulation.
Core Advantages
- Thermoelectric separation design Heat and electricity transmission paths are separated. Heat generated by high-power chips can transfer rapidly to the aluminum substrate, while the circuit keeps reliable electrical isolation, greatly reducing leakage and short-circuit failure risk.
- 1.6mm standard thickness aluminum base Stable mechanical rigidity, good flatness, easy for SMT assembly, fixture clamping and screw mounting; compatible with conventional aluminum PCB production and welding process.
- Double-sided wiring available Circuits can be arranged on top and bottom sides, higher component density than single-sided aluminum PCB, saving overall module space.
- Excellent heat dissipation capacity Aluminum metal core has high thermal conductivity, quickly export heat from LED, power tube and high-power chips, lower junction temperature and extend service life.
- High insulation reliability High-performance thermal insulation dielectric layer, high breakdown voltage, anti-breakdown, stable insulation performance under long-term high-temperature working state.
- Good electromagnetic & thermal stability Low thermal expansion coefficient, less deformation under repeated temperature cycling, suitable for continuous long-time high-power operation.
Signal & Thermal Performance Features
- Independent thermal path will not interfere with electrical signal transmission; the isolation dielectric layer blocks DC leakage.
- Supports power circuit, DC signal and low-frequency control signal layout; not recommended for high-speed differential signals.
- Thermal conductivity of dielectric layer is customizable (1.0~3.0 W/m·K), balance heat dissipation and insulation requirements.
- Low impedance power traces, reduce voltage drop for high-current power loops.
- Insulation resistance ≥10⁸Ω, dielectric breakdown voltage ≥2kV, safe for medium voltage power applications.
- Stable impedance for conventional power traces on request.
Technical Parameters
| Item | Specification |
|---|---|
| Product Name | 1.6mm Double-sided Thermoelectric Separation Aluminum PCB |
| Substrate | Aluminum base (1050/5052 aluminum alloy) |
| Board Thickness | 1.6mm |
| Structure | Double-sided circuit, thermoelectric separation structure |
| Copper Thickness | 1oz / 2oz / 3oz customizable |
| Dielectric Thermal Conductivity | 1.0 ~ 3.0 W/m·K optional |
| Min Trace / Space | 0.2mm / 0.25mm |
| Surface Finish | HASL, OSP, Immersion Gold, Immersion Silver |
| Insulation Voltage | ≥2kV |
| Operating Temperature | -40℃ ~ +125℃ |
| Compliance | RoHS, REACH, UL94 V-0 |
| Key Feature | Double-sided layout, thermoelectric isolation, aluminum heat dissipation substrate |
Application Scenarios
- High-power LED lighting: High-power COB light source, flood light, plant growth lamp
- Power electronics: DC-DC power module, switching power supply, relay power drive board
- Semiconductor cooling: High-power MOSFET, IGBT power carrier board
- New energy equipment: Small battery charging module, photovoltaic micro inverter power board
- Industrial equipment: Industrial heater control unit, high-current drive module
- Medical equipment: High-power therapeutic light source, constant current drive board
