2.54mm Pitch FR4 Breadboard PCB for Electronic Prototyping

I. Specifications

II. Features

1. Standard 2.54mm (0.1″) grid pitch, fully compatible with 2.54mm pin headers, dupont wires, IC sockets and through-hole components.
2. FR4 substrate provides good mechanical strength and flatness, not easy to warp during hand soldering.
3. Flexible prototyping layout: users can solder jumpers, resistors, capacitors, ICs and modules freely on the grid.
4. Clear silkscreen grid lines help quick component placement and wiring arrangement.
5. Wide working temperature range, suitable for lab test, student training, hobby DIY and pre-production prototype verification.
6. Low cost, fast lead time for small batch prototype orders.
7. Single-sided version for simple circuit; double-sided version allows bottom-layer jumper wiring for complex prototypes.

III. Design Principle

This breadboard PCB follows the universal 0.1-inch grid standard for through-hole electronics:

1. 2.54mm grid system: The whole board is arranged by fixed 2.54mm hole matrix. This is the industry standard spacing for through-hole DIP ICs, pin headers and sockets.
2. Hole design: 1.0mm finished holes are reserved for component pins. Users decide interconnection by soldering copper traces or wire jumpers by hand.
3. Copper pad design: Each hole has a round pad for soldering. Pads can be independent or pre-connected in strips (strip breadboard type).
   • Two popular types: blank grid protoboard (all pads isolated) / bus-strip protoboard (power rails pre-connected)
4. Stack-up:
   • 1-layer: copper only on top side, bottom pure FR4, cheaper for simple circuits.
   • 2-layer: top + bottom copper, can run hidden jumpers on the bottom to avoid messy wiring on top.

This board is not pre-wired like plastic solderless breadboard; it is a solderable prototyping PCB.

IV. Core Manufacturing Advantages

1. Stable FR4 material with good flatness, less warpage under repeated hand soldering.
2. Consistent 2.54mm hole position accuracy, pins and sockets can be inserted smoothly without forcing.
3. Smooth pads and reliable surface finish: OSP / HASL keep good solderability for manual soldering.
4. Customizable options: blank grid, power rail strips, pre-marked +5V/GND bus, custom board size.
5. Large panelized production, low MOQ and competitive price for university labs, hobby retailers.
6. Clear non-fading white silkscreen grid, easy to read even after multiple soldering operations.
7. 100% open/short electrical test before shipment.

V. Signal & Electrical Performance

1. Insulation between isolated pads: High insulation resistance, low leakage current for low-voltage analog and digital prototype circuits.
2. Bandwidth: Suitable for DC, low-frequency digital signals, analog sensor signals, up to several MHz. Not designed for high-speed RF / high-frequency signals.
3. Current capacity:
   • 1oz copper (35μm): ~2–3A per single track (depends on track width)
   • 2oz copper (70μm): ~4–6A for power supply tracks
4. EMC performance: No built-in ground plane by default. Users need to add ground wires manually for noise-sensitive circuits.
5. Application limit: Mainly for low voltage DC prototype (5V, 12V, 24V). Not for high voltage or high-power continuous heavy load.