FR4 Multilayer PCB is high-performance rigid circuit board built on FR4 substrate, widely adopted for complex industrial control electronics. Equipped with green solder mask and ENIG surface treatment, this multilayer PCB delivers stable insulation, consistent mechanical strength and excellent solderability for SMT and DIP assembly.
Key Points of Parameter Specifications
- Layer count: 4–16 layers (4–10 layers commonly used in industrial control); provides complete power and ground planes.
- Material: High-Tg FR4 (Tg 150–170°C); resistant to high-temperature deformation and suitable for a wide industrial temperature range.
- Solder mask: Green solder mask, thickness ≥25μm, reliable insulation.
- Surface finish: ENIG, good solderability, flat surface, long shelf life, ideal for BGA / fine-pitch components.
- Copper weight: 1~3oz, heavier copper available for high-current tracks.
- Impedance control: 50/100Ω, ±10%, supports communication signals.
- Operating temperature: -40~+105°C; flame retardant UL 94V-0.
Signal Performance Features
- Full power & ground planes for stable power supply, low noise and strong EMI suppression.
- Controlled impedance, supports Ethernet, RS485, CAN, USB and other industrial communication.
- Ground plane shielding, anti-electromagnetic interference for harsh industrial sites.
- Suitable for medium & high speed signals; high-frequency substrate required for RF / microwave circuits.
- Flat ENIG surface improves BGA assembly yield and solderability.
Application Fields
- PLC, servo & inverter, industrial PC, data acquisition, switching power supply, UPS
- Robotics, automation, energy meter, EV charger, PV inverter, energy storage and other industrial & power electronics equipment
Volectronics Tech Co., Ltd is your one-stop PCB prototype fabrication and assembly partner — a leading PCB manufacturing company. From single-layer to complex multilayer boards, we deliver high-quality PCBs backed by UL, ISO, RoHS, and IPC compliance.
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