FR4 Multilayer PCB is widely adopted for industrial control equipment, featuring rigid FR4 substrate, green solder mask and reliable ENIG surface finish. It is custom manufactured to match your circuit requirements for automation and control hardware.
Parameter specification
Plate thickness:1.2~3.2mm
Material: FR4；High Tg 170℃ / The medium Tg is 150℃
Copper thickness:1 to 3oz, local thickening for high current
Copper thickness: 5/5~3/3mil
Drilling: Through holes starting from 0.2mm; Blind buried holes are optional
Drilling: ENIG (Electroless Nickel/Immersion Gold), Immersion Tin, OSP, Gold Plating
Solder mask: Green / Black / Butter, thickness ≥25μm
Performance characteristics
- High reliability: Multi-layer, continuous power and ground planes ensure stable power delivery and low noise; high-Tg material resists deformation at high temperatures.
- High-current capability: Thickened copper and wide copper pours allow for carrying currents of tens of amperes, making it suitable for motor drives and high-power supplies.
- Robust EMC capabilities: Internal ground plane shielding and signal isolation routing suppress electromagnetic interference in industrial environments.
- Wide-temperature operation: High-Tg/medium-Tg materials support a range of -40°C to 105°C (or even higher), making them suitable for harsh environments.
- Mechanical/Environmental Resilience: Resistant to vibration, shock, humidity, and salt spray; suitable for cabinet or field installation.
- Dimensions and Multi-layer Routing: Complex logic is routed across multiple layers, reducing area and increasing integration density.
Solder mask characteristics
• Green solder mask is standard for industrial control boards (offering reliable insulation), while black or yellow masks are used for specific aesthetic requirements or thermal identification.
• Solder mask requirements include a thickness of ≥25μm, high dielectric strength, and resistance to moisture and abrasion, ensuring coverage of traces and vias to prevent short circuits.
• Precise openings are required for pad areas with no exposed copper on traces; vias are covered or plugged to prevent moisture ingress and short circuits (though openings may be used for high-current vias to aid heat dissipation).
• High alignment precision at the solder mask edges is essential to prevent pad misalignment from compromising SMT assembly yields.
Signal performance characteristics
• The multi-layer structure enables impedance control for microstrip and stripline configurations and supports industrial communication protocols such as Ethernet (100M/1G), USB, RS485, and CAN.
• Continuous ground plane → Short signal return paths, low crosstalk, and stable timing.
• Suitable for low-to-medium and medium-to-high speed signals; high-speed differential signals (e.g., Ethernet, PCIe) perform better when routed on internal layers.
• Note: Given the harsh electromagnetic environments typical of industrial sites, keep signal lines away from power lines, implement shielding, and ensure adequate power-to-ground decoupling.
We provide custom FR4 multilayer PCBs for industrial control applications. Our printed circuit boards adopt high-quality FR-4 substrate, featuring excellent thermal stability, reliable insulation and strong anti-interference performance, suitable for various industrial control systems, automation equipment and power control modules.
We support customization of layer count, copper thickness, board thickness, surface finish and solder mask color. Every PCB will go through strict electrical test and visual inspection before delivery to guarantee stable performance in harsh industrial environments.
Contact us to get your PCB quotation with your Gerber files and specifications.
