Our FR4 Rigid Multilayer PCB, 6–40 Layers, ENIG Grid Pad Layout is a multi-layer rigid circuit board built on FR4 material with matrix immersion gold pads for multi-component and multi-channel interconnection.
Product Overview
Our FR4 Rigid Multilayer PCB is a custom multilayer circuit board ranging from 6 to 40 layers, built on reliable FR4 dielectric material. It features dense ENIG (Immersion Gold) grid pad layout, with neatly arranged matrix pads for mass component soldering and multi-channel signal interconnection. The immersion gold surface treatment provides flat, oxidation-resistant pad surfaces, excellent solderability and reliable contact performance. Symmetric stack-up design is adopted for high-layer boards to minimize warpage. This board is widely customized for test modules, industrial control, power arrays and multi-channel signal circuits, supporting both prototype quick turnaround and volume mass production.
Core Advantages
✅ 6–40 layers, customizable FR4 stack-up, support standard FR4, high-Tg and halogen-free FR4 options
✅ ENIG immersion gold finish, flat pad surface, anti-oxidation, stable soldering performance
✅ Dense grid pad layout, centralized matrix pads for multi-component layout and multi-channel wiring
✅ Symmetric lamination structure, effectively reduce board warpage during repeated reflow
✅ Strict layer alignment control, stable inner-layer routing consistency for high-layer stacks
✅ Customizable controlled impedance, good signal integrity for differential high-speed signals
✅ Full AOI, X-ray and 100% electrical continuity testing before delivery
✅ IPC Class 2 / Class 3 reliability optional, RoHS & REACH compliant
Signal & Electrical Performance
✅ Stable impedance control, tolerance ±5% / ±8% available for differential pairs
✅ Low dielectric loss, suitable for digital signal, bus signal and moderate high-speed transmission
✅ Isolation design between pad arrays, reduce crosstalk and signal interference between adjacent channels
✅ ENIG surface avoids pad oxidation, keeps stable contact resistance for long-term use
✅ Low leakage current and good insulation property of FR4 substrate, reliable in continuous working condition
✅ Balanced copper distribution to avoid uneven electrical performance caused by stress deformation
Technical Specification Table
| Item | Specification |
|---|---|
| Base Material | Standard FR4, High-Tg FR4 (Tg150℃ / 170℃ /180℃), Halogen-free FR4 |
| Total Layers | 6L ~ 40L customizable |
| Copper Thickness | 0.5oz / 1oz / 2oz / 3oz heavy copper optional |
| Min Line / Space | 3mil / 3mil |
| Via Type | Mechanical PTH, blind & buried vias optional |
| Minimum Drill Hole | 0.2mm |
| Surface Finish | ENIG (Immersion Gold) |
| Solder Mask | Green, black, blue, red, yellow LPI solder mask |
| Board Thickness | 0.8mm ~ 5.0mm |
| Impedance Tolerance | ±5%, ±8%, ±10% |
| Operating Temperature | -40℃ ~ +130℃; High-Tg version up to 170℃ |
| Compliance | IPC-6012, RoHS, REACH |
Typical Application Scenarios
- Multi-channel test fixture and test array modules
- Industrial automation control circuit board
- Power management array board, multi-channel relay module
- Communication gateway and signal distribution board
- Automotive electronic auxiliary control modules
- Medical equipment multi-channel acquisition circuit
- IoT multi-sensor integrated circuit board
