Product Overview
Multi-layers FR4 PCB Board with Parallel Routing + Edge Connector is a multi-layer rigid FR4 circuit board built for multi-channel parallel signal transmission. It adopts neatly parallel length-matched routing and integrates hard-gold edge connector (gold finger) on the board edge. Multiple signal traces run in parallel with consistent line width, spacing and trace length. Signals are brought out uniformly to the edge connector, enabling direct plug-and-play connection with backplanes, test sockets and module interfaces. It is a cost-effective solution for multi-bus parallel transmission, data acquisition and industrial modular interconnection.
Core Advantages
- Standardized parallel routing design Parallel traces with consistent length, width and spacing. It keeps uniform delay for multi-channel parallel signals, reduces signal skew and ensures synchronous data transmission.
- Integrated edge gold finger connector Hard gold plating on edge connector, stable low contact resistance, anti-oxidation, supports repeated plugging and unplugging. No extra connector soldering required, simplifying assembly.
- Mature multi-layer FR4 technology, cost efficient Adopt reliable FR4 substrate (high-Tg optional), stable process, good mechanical strength and heat resistance, much more economical than high-frequency or rigid-flex boards for parallel bus applications.
- Controllable impedance and good shielding Complete inner ground/power reference planes. Isolation design between parallel channels can be added on request to suppress crosstalk and EMI interference.
- Convenient for testing and mass assembly All parallel signals converge orderly to the edge connector. Easy for fixture probing, batch functional testing and modular quick replacement.
- Flexible customization Custom layer count, number of parallel channels, trace pitch, board thickness and gold finger layout according to your bus definition.
Technical Parameters
| Item | Specification |
|---|---|
| Product Name | Multi-layers FR4 PCB Board, Parallel Routing + Edge Connector |
| Base Material | FR4, High Tg FR4 (130℃ / 150℃ / 170℃) |
| Layer Count | 4L / 6L / 8L / 10L /12L, customizable |
| Copper Foil | 12μm / 18μm / 35μm |
| Min Trace / Space | 0.1mm / 0.1mm |
| Edge Connector Finish | Hard gold plating; Ni:2–5μm, Au:0.3~1.27μm, chamfer optional |
| Impedance | Single-ended / differential controlled impedance available |
| Operating Temperature | -40℃ ~ +130℃ |
| Board Thickness | 0.8mm ~ 3.2mm |
| Outline Tolerance | ±0.075mm |
| Compliance | IPC-6012, RoHS, REACH, UL94 V-0 |
| Key Feature | Multi-channel parallel routing, length matching, edge gold finger connector |
Application Scenarios
- Industrial control：PLC extension board, multi-channel data acquisition board, relay control module
- Test & measurement：Multi-channel signal test adapter, ICT/FCT test board
- Communication equipment：Backplane interconnection board, parallel bus interface card
- Display module：Parallel LVDS interface board, screen driver transfer board
- Automation equipment：Sensor array signal distribution board, motion control signal card
- Educational equipment & embedded system：Multi-channel parallel bus demo board
About Our Company
We are a professional multi-layer FR4 PCB manufacturer based in Shenzhen. We focus on controlled impedance boards, parallel routing boards, edge connector / gold finger PCBs for industrial automation, test & measurement and communication customers.
Our team is good at parallel bus layout, length matching and edge connector process control. Every PCB goes through AOI and open-short electrical testing. We offer fast prototypes, stable small-batch and mass production with competitive lead time and price.
We support customers from Europe, Russia and other overseas regions for industrial modular projects and test fixture solutions.
