Green Rigid-Flex PCB with Orange FPC Cable, Gold Plated Pads is a hybrid printed circuit board that combines rigid FR-4 mounting sections with bendable orange polyimide flexible cable sections.
The green solder mask covers all rigid areas for component protection, while the orange PI flex cable folds into tight 3D spaces to replace traditional wire harnesses and separate connectors.
Gold-plated contact pads provide stable, low-resistance electrical connection for repeated mating and long-term reliable operation.
1. Specifications
- Board Type: Rigid-Flex PCB (R-F Board), combining rigid FR-4 sections and flexible FPC sections
- Rigid Section Material: FR-4 / High Tg FR-4, green LPI solder mask
- Flex Section Material: Orange Polyimide (PI) film with orange coverlay
- Layer Count: 2L / 4L / 6L rigid-flex combination, customizable
- Rigid Board Thickness: 0.8mm – 2.0mm
- Flex Cable Thickness: 0.1mm – 0.3mm (single / double sided FPC)
- Copper Weight: 0.5oz (18μm) / 1oz (35μm)
- Minimum Trace / Space (Rigid): 0.1mm / 0.1mm
- Minimum Trace / Space (Flex): 0.075mm / 0.075mm
- Surface Finish: ENIG (Immersion Gold) on contact pads; OSP / HASL-LF optional
- Gold Plating Thickness: 0.05μm – 0.1μm on mating pads
- Flex Bending Radius: ≥6× flex thickness (static bend)
- Impedance Control: Available on rigid section high-speed lines
- Certification: UL, RoHS 2.0, REACH, IPC-6013
- Quality Test: 100% flying probe test + AOI inspection
2. Design Principle
A rigid-flex PCB integrates rigid printed circuit boards and flexible printed circuits into a single interconnected assembly. The rigid FR-4 sections provide flat, stable mounting platforms for SMT components, connectors and shielding, while the orange PI FPC sections act as bendable cables that route signals through narrow gaps, folded spaces or moving hinges.
The rigid and flex layers are bonded together during sequential lamination. Interconnection between rigid and flex sections is achieved through plated through-holes and vias located in the rigid transition zones, avoiding stress concentration on the flexible bend area. The orange FPC cable replaces traditional wire harnesses and separate connectors, reducing overall assembly complexity and connection points.
Gold-plated pads on both rigid connector areas and flex tail ends provide low contact resistance, anti-oxidation performance and reliable mating for repeated plugging cycles. The green solder mask on rigid sections protects copper traces from oxidation and short circuits, while the orange PI coverlay on flex sections protects copper traces during repeated bending.
3. Manufacturing & Process Advantages
- Integrated rigid-flex design: eliminates separate FPC, rigid PCB and wire harness, reducing total component count
- Sequential lamination: rigid and flex layers bonded in controlled registration, reliable interconnection at transition zones
- Orange PI coverlay on flex area: provides superior flex endurance compared to liquid solder mask on bending sections
- Selective gold plating: gold applied only to mating pads, balancing contact reliability and cost control
- No loose cable connections: rigid-flex structure eliminates connector failure and wire loosening under vibration
- Space and weight saving: folded 3D routing allows compact product enclosure design
- DFM review before production: engineering team checks bend radius, via placement and component clearance
- Supports both prototype and mass production with consistent quality
- Panel design protects flex sections during SMT assembly of rigid sections
- Customizable flex length, fold direction and rigid section layout per customer Gerber files
4. Typical Applications
- Consumer electronics: smartphones, tablets, foldable devices, wearable gadgets
- Camera modules and display interconnect boards
- Medical portable devices: patient monitors, diagnostic instruments, handheld scanners
- Automotive interior: display panels, sensor interconnects, steering wheel controls
- Industrial control: sensor modules, robotic arm interconnect boards, control panel assemblies
- Communication devices: handheld terminals, IoT gateways, portable radio units
- Aerospace and non-classified defense: avionics panel interconnects, onboard control modules
- Test and measurement equipment, compact electronic devices requiring folded cable routing
5. About Us
We are a professional PCB manufacturer based in China, specializing in OEM/ODM custom printed circuit board production for global customers. With years of manufacturing experience, we provide one-stop PCB solutions covering standard FR-4 boards, aluminum MCPCBs, HDI boards, high-frequency boards, ceramic substrates and rigid-flex PCBs.
We serve customers across Europe, North America, Russia, Southeast Asia and other regions, delivering stable quality, competitive pricing and on-time delivery. Whether you need a small batch prototype or high-volume production, we are ready to support your project.
