Volectronics offers Rigid-Flex Multilayer PCB Prototype & Production services, delivering a single integrated board that combines rigid multilayer sections for component mounting with flexible polyimide sections for bending and folding. This one-piece construction eliminates connectors and solder joints between separate boards, reducing failure points, weight, and volume while significantly improving reliability — making it ideal for medical, aerospace, military, and high-reliability compact electronics.
Technical Specifications (Table)
| Item | Typical Value |
|---|---|
| Construction | Multilayer Rigid + Flex core layers (integrated) |
| Layers | Rigid 4–16L + Flex layers |
| Rigid Material | FR4, High Tg (150–170°C) |
| Flex Substrate | Polyimide (PI) 12.5–25μm |
| Copper Type | RA (flex area) / ED (rigid area) |
| Min Trace/Space | 4/4–3/3 mil |
| Min Hole Size | 0.2 mm mechanical; microvia for HDI |
| Bend Radius | Dynamic ≥10× thickness; Static ≥3× |
| Flex Life | 10k–100k+ cycles (RA copper) |
| Operating Temp. | −65 ~ +150°C |
| Impedance Control | 50/100Ω controlled |
| Surface Finish | ENIG / Immersion Gold |
| Prototype Lead Time | Fast (7–15 days) |
| Certifications | IPC-6013 / UL 94V-0 |
Integrated Rigid-Flex Construction
Each Rigid-Flex Multilayer PCB is laminated together in one piece: rigid FR4 sections (up to 16 layers, High Tg 150–170°C) carry BGAs, connectors, and heavy components, while flexible PI sections (12.5–25μm) allow the board to fold and bend for 3D assembly in tight or irregular enclosures. The flexible layers are positioned around the neutral axis to minimize bending stress, and transition zones include flex extension buffers to prevent tearing and stress concentration at the rigid-flex boundary.
Engineered for Bending Reliability
Dynamic bending uses rolled-annealed (RA) copper and PI coverlay for a flex life of 10,000–100,000+ cycles, while static bending allows a smaller bend radius of 3× thickness. Traces in the flex area run perpendicular to the bending axis, with no vias, pads, or openings in the bend zone — key design rules that prevent stress fractures and ensure long-term mechanical durability.
Electrical Performance
Rigid-Flex multilayer boards support microstrip and stripline impedance control (50/100Ω), enabling high-speed differential signals with low crosstalk thanks to internal shielding layers. Controlled impedance and balanced stack-up deliver reliable signal integrity for demanding applications.
Prototype to Production
We provide a complete Rigid-Flex service from fast prototyping (7–15 days) to volume production, with full reliability testing including thermal cycling, temperature-humidity, flex life, and insulation/withstand tests. Boards meet IPC-6013 and UL 94V-0 standards, and ENIG surface finish ensures excellent solderability and long shelf life.
Volectronics delivers reliable, high-density Rigid-Flex Multilayer PCB solutions from prototype to volume production. Contact us for a custom quote on your rigid-flex design.
