Rigid-Flex PCB boards combine the mechanical support of rigid FR-4 sections with the bending freedom of flexible polyimide (PI) sections. This OEM/ODM custom rigid-flex PCB board features black PI flex layers paired with rigid FR-4 modules, designed for compact electronic products where space, weight and reliability are critical requirements.
1. Specifications
- Board Type: Rigid-Flex Printed Circuit Board (R-F PCB), OEM/ODM custom design
- Flex Layer Material: Black Polyimide (PI) film
- Rigid Layer Material: FR-4 / High Tg FR-4 (optional Rogers / high-frequency material)
- Layer Count: 2L / 4L / 6L / 8L rigid-flex combination, customizable
- Total Board Thickness: 0.6mm – 2.4mm (rigid section), flex section 0.1mm – 0.3mm
- Copper Weight: 0.5oz (18μm) / 1oz (35μm) / 2oz (70μm)
- Minimum Flex Trace / Space: 0.075mm / 0.075mm
- Minimum Rigid Trace / Space: 0.1mm / 0.1mm
- Minimum Drill Size (Rigid): 0.2mm (PTH)
- Coverlay: Black PI coverlay on flex area, with adhesive
- Solder Mask: Black LPI solder mask on rigid sections (green/white optional)
- Surface Finish: ENIG (Immersion Gold) / OSP / Immersion Silver / HASL-LF
- Flex Bending Radius: ≥6× flex thickness (static bend) / ≥10× (dynamic bend)
- Impedance Control: ±10% on rigid section controlled lines
- Certification: UL, RoHS 2.0, REACH, IPC-6013 (rigid-flex standard)
- Assembly Test: 100% flying probe electrical test + AOI inspection
2. Performance Characteristics
- Combined advantages of rigid PCB and flexible PCB: rigid sections support SMT components and connectors, flex sections allow 3D space folding and bending
- Black PI film provides excellent heat resistance, chemical resistance and dimensional stability
- Excellent flex endurance: static bending life >10,000 cycles; dynamic bending available for repeated folding applications
- High interconnect density: reduces connector and cable assembly count, simplifies system integration
- Good electrical insulation: PI material offers high dielectric strength and low leakage current
- Stable signal transmission: controlled impedance on rigid sections for high-speed signals; flex section designed for short-distance interconnect
- Vibration and shock resistance: eliminates loose wire connections, improves reliability under mechanical stress
- Lightweight and thin: reduces overall product weight and volume compared to rigid PCB + wire harness solutions
3. Solder Mask & Coverlay Properties
- Rigid section: Black LPI solder mask, uniform coating, strong adhesion to copper
- Flex section: Black PI coverlay with adhesive, not liquid solder mask — PI coverlay provides much better flex endurance than ink on bending areas
- Black solder mask offers low reflectance, suitable for optical modules and camera systems where stray light must be minimized
- Coverlay thickness controlled within ±12.5μm, ensures consistent flexing performance
- Black PI film provides good UV resistance and maintains mechanical properties across -65°C to +150°C operating range
- Solder mask on rigid sections protects copper traces from oxidation, short circuit and mechanical scratch
- White silkscreen legend on black mask provides high contrast for component placement identification
4. Manufacturing & Process Advantages
- OEM/ODM full custom service: supports customer-provided Gerber files, DFM feedback, stackup optimization
- Rigid-flex lamination process: sequential lamination of rigid FR-4 and flex PI layers with controlled alignment accuracy
- Capable of complex fold geometries: single-sided fold, double-sided fold, multi-bend configurations
- No connector and cable harness needed: reduces total BOM cost and assembly labor
- Panelize design: rigid sections panelized for standard SMT assembly, flex sections protected during assembly
- Impedance control available for high-speed signal lines on rigid sections
- Tight registration between rigid and flex layers ensures reliable interconnection at transition zones
- Supports both prototype and volume production with consistent quality
- DFM review before production: flags potential design issues that could affect yield or reliability
5. Typical Applications
- Consumer electronics: smartphones, tablets, wearable devices, camera modules
- Medical devices: portable medical instruments, patient monitoring systems, diagnostic equipment
- Industrial: industrial control panels, sensor modules, robotic control units
- Automotive: automotive interior displays, sensor control units, camera systems (non-safety critical)
- Aerospace and defense (non-classified): avionics instrument panels, onboard control modules
- Communication: portable communication devices, handheld terminals, IoT gateway modules
- Military/aerospace embedded systems, test equipment, and compact electronic devices where space and weight are critical constraints
6. About Us
We are a professional PCB manufacturer based in China, specializing in OEM/ODM custom printed circuit board production for global customers. With years of manufacturing experience, we provide one-stop PCB solutions covering standard FR-4 boards, aluminum MCPCBs, HDI boards, high-frequency boards, ceramic substrates and rigid-flex PCBs.
Our factory is equipped with advanced production lines and testing facilities, ensuring reliable quality from prototype to mass production. We strictly follow IPC standards and hold UL, RoHS and REACH certifications. Our engineering team provides DFM feedback, technical support and fast response to customer inquiries.
We serve customers across Europe, North America, Russia, Southeast Asia and other regions, delivering stable quality, competitive pricing and on-time delivery. Whether you need a small batch prototype or high-volume production, we are ready to support your project.
For inquiries, please send your Gerber files and requirements to our sales team for a quick quote within 24 hours.
