Prototype Custom High Thermal Conductivity Metal Core MCPCB

Prototype Custom High Thermal Conductivity Metal Core MCPCB (also known as aluminum PCB) is a metal core circuit board designed for high-power LED modules, featuring excellent heat dissipation and reliable insulation performance. We support custom layout, dot-matrix COB array pattern, fast prototype and small-batch to mass production service.

Core Selling Points

1. Ultra-high thermal conductivity aluminum base, fast heat transfer, greatly reduce LED junction temperature, extend light source service life
2. Custom layout & array pattern support, COB / LED array design available (match your picture dot matrix layout)
3. Quick prototype service, small batch & mass production support
4. Excellent electrical insulation, high breakdown voltage, safe for high-power lighting
5. Low thermal resistance structure, avoid thermal accumulation for dense LED arrays
6. Stable dimensional performance, anti-aging, good environmental adaptability for indoor & outdoor lighting
7. Custom size, copper thickness, solder mask color, surface finish options

Specification Table

Design Principle

MCPCB is a metal-based heat dissipation circuit board, consists of three layers: conductive copper circuit layer, thermally conductive insulating dielectric layer, aluminum metal base layer.

• Copper layer: carry current, form LED circuit traces and bonding pads
• Dielectric layer: The core functional layer. It isolates electricity while conducting heat, blocking electrical breakdown and transferring heat from the LED chip quickly to the aluminum base
• Aluminum base layer: High heat capacity metal substrate, spreads heat to the air rapidly, eliminates local hot spots. For the dot-matrix COB array type as shown in the picture: evenly distributed pad array design, uniform thermal spreading, ensuring each LED unit has consistent heat dissipation and stable luminous consistency.

 Performance Characteristics

1. Heat Dissipation Performance: Far better than standard FR4 PCB. Concentrated heat from high-power LED components can be quickly diffused, prevent light decay and brightness drop.
2. Insulation Performance: High dielectric strength insulating layer, withstand high voltage, prevent short circuit risk under high power.
3. Mechanical Performance: High rigidity, not easy to bend, good shock resistance.
4. Thermal Stability: Small thermal expansion coefficient, less deformation under long-time temperature cycling, good solder joint reliability.
5. Electrical Performance: Stable impedance, suitable for DC drive circuit of LED modules.
6. Weather Resistance: Anti-moisture, anti-corrosion, suitable for harsh industrial and outdoor lighting environment.

 Manufacturing & Process Advantages

1. Mature aluminum substrate processing: special milling & drilling process to avoid burr and aluminum base scratch
2. Strict dielectric layer lamination control: ensure uniform thickness, stable thermal conductivity without voids
3. Precision imaging & etching: achieve fine circuit and regular COB pad array
4. Stable solder mask coating: good adhesion, no peeling under repeated heating
5. Custom surface treatment options: ENIG for good solderability and wire bonding for COB chips
6. 100% electrical open/short test before shipment; thermal resistance inspection available on request
7. Support special array pattern, custom marking and fiducial mark as customer’s drawing

Application Scenarios

• COB LED array modules (the type in your photo)
• High power LED flood light, street light, high bay light
• UV LED, IR LED module
• Automotive LED lighting
• Industrial high-power lighting equipment
• Backlight display, stage lighting