Our ultra-thin high-temperature resistant Flexible Circuit Board supports dynamic bending for electronics. Custom layer count, polyimide material and surface treatment available for your flexible PCB projects.
Specifications
- Base Material: Polyimide (PI) / PI with adhesive / Adhesiveless PI film (adhesiveless for high temp)
- Total Board Thickness: 0.03mm ~ 0.2mm (Ultra-thin range)
- Copper Foil: Rolled annealed copper (RA Copper), 1/3 oz, 1/2 oz, 1 oz; ultra-thin copper 9μm /12μm /18μm
- Layer Count: 1~8 Layers Flexible PCB
- Minimum Line Width / Space: 25μm /25μm
- Minimum Via Diameter: 0.1mm laser microvia
- Surface Finish: ENIG (Immersion Gold), Immersion Silver, OSP, Hard Gold Plating
- Operating Temperature Range: -40℃ ~ +200℃ (continuous working), peak temp up to 260℃ for reflow soldering
- Flex Bending: Dynamic bending >100,000 cycles (depends on structure); static folding available
- Dielectric Constant (Dk): 3.2~3.5 at 1GHz
- Tolerance: ±0.02mm for outline & trace
Solder Mask Properties
- Solder Mask Type: Flexible PI compatible liquid photoimageable solder mask (LPI) / Coverlay film (the primary protection for FPC)
Note: Coverlay is widely used on FPC instead of traditional solder mask ink; LPI is for fine trace areas
- Temperature Resistance: Coverlay & adhesive withstand 260℃ peak reflow temperature, no delamination, bubbling or peeling
- Elongation: High elongation rate, maintains flexibility during repeated bending, no crack on cover layer
- Electrical Insulation: High volume resistivity, excellent dielectric breakdown strength, prevent short circuit under bending
- Chemical Resistance: Resist flux, cleaning solvent, plating chemicals Color: Amber / Black / Green coverlay (custom color available)
- Feature: Low-stress coating, good adhesion to PI substrate and copper traces
Signal Performance
- Controlled impedance available: 50Ω, 90Ω, 100Ω differential pair for high-speed signal
- Low signal attenuation: Low Df (dissipation factor), minimal insertion loss at high frequency
- Stable electrical property under thermal cycling: Dk/Df keeps consistent after multiple thermal shocks
- Low crosstalk: Optimized trace spacing & ground shielding layer design to reduce electromagnetic interference
- Consistent impedance control on ultra-thin dielectric, suitable for high-speed serial signals
- Good EMC performance with properly designed ground plane
VolectronicsTech Co., Ltd was established in 2017 and is dedicated to providing one -stop services for orders ranging fromprototyping and small-to-medium batch production to large-scale mass production.
As a one-stop PCB manufacturer, we deliver high-quality PCB manufacturing and assembly services to a broad range of industries,including, but not limited to, industrial control, automotive, energy and power, IoT, robotics, new energy, test and measurement,telecommunications, healthcare, aerospace, LED lighting, and consumer electronics. We consistently meet the industry’s mostwidely recognized IPC standards —IPC-A-600 for PCB manufacturing and IPC-A-610 for PCB assembly.
Welcome to contact us for more quotation details.
