High Speed Controlled Impedance HDI Multilayer PCB Board

High Speed Controlled Impedance HDI Multilayer PCB adopts high-performance low Dk/Df substrate material, HDI microvia technology, precise impedance control design. It is built for high-speed digital transmission scenarios, ensures stable signal integrity, widely used in data communication, server, optical module, high-end industrial control and automotive electronics.

Specifications

• Layers: 4~20 layers, customizable
• Base Material: FR-4 high TG / low loss FR4, optional high-speed substrate (Isola, Rogers, Panasonic)
• Copper Thickness: 0.5oz ~ 2oz
• Min Line Width/Spacing: 0.075mm / 0.075mm
• Min Microvia Diameter: 0.1mm (blind & buried vias)
• Board Thickness: 0.4mm ~ 3.2mm
• Surface Finish: ENIG, HASL, OSP, Hard Gold, Immersion Silver
• Solder Mask: Green, Black, Blue, White, Matte/Gloss available
• Tolerance of Dimension: ±0.1mm
• Impedance Tolerance: ±5% (standard), ±3% for strict requirement
• TG Value: 170℃ / 180℃ / 210℃ optional

Impedance Characteristics

• Supports single-ended impedance & differential pair impedance design (50Ω, 100Ω, 90Ω, 85Ω etc., customized)
• Pre-stack impedance simulation before production, adjust dielectric thickness, trace width, copper thickness to meet target impedance
• Tight impedance tolerance ±3%~±5%, reduce impedance discontinuity caused by microvia, trace necking
• Low dielectric loss (Df), stable Dk over wide frequency range, minimal impedance shift at high frequency
• Impedance testing by TDR (Time Domain Reflectometer) for verification before shipment

Signal & Electrical Performance

• Low insertion loss & low return loss, excellent signal integrity for high-speed signals up to 25Gbps+
• Controlled crosstalk between adjacent differential pairs, reduce electromagnetic interference (EMI)
• Low parasitic capacitance and inductance, minimize signal reflection & distortion
• Insulation resistance: ≥10¹² Ω, Dielectric Withstanding Voltage ≥500V
• Excellent tracking resistance, stable electrical performance under continuous high-frequency operation
• Optimized return path design to reduce ground bounce and noise

Manufacturing & Process Advantages

1. HDI Microvia technology (laser drilling blind/buried vias): higher routing density, save board space, shorten signal path length
2. Pre-production stack-up simulation + DFM review, catch impedance and SI risk at early design phase
3. Precise inner layer lamination & dielectric thickness control, guarantee consistent impedance across whole panel
4. Fine line & fine spacing process capability, support dense BGA pad routing
5. Strict layer registration control, prevent layer misalignment affecting impedance and yield
6. Full inspection: AOI, X-ray, TDR impedance test, continuity & isolation electrical test
7. Custom stack-up, impedance value and material selection to match customer high-speed design requirement

Typical Applications