Our Ultra-Fine Trace Rigid-Flex PCB with Coverlay & Precision Layout adopts PI coverlay protection and LDI high-precision imaging for high-density wiring and reliable dynamic bending applications.
Core Selling Points
- Ultra-fine trace precision layout, min 3mil/3mil line & space, realize high-density interconnection in limited space
- Adopt professional PI coverlay protection instead of ordinary flex solder mask, strong bending resistance, no cracking after repeated flexing
- Integrated rigid FR4 + polyimide flex structure, 3D folding installation, reduce connectors and wiring harness failure points
- Strict alignment control for coverlay laser opening, precise pad window, stable soldering performance
- RA rolled annealed copper for flex zone, excellent fatigue resistance for dynamic cyclic bending
- Optional controlled differential impedance, good signal integrity for high-speed LVDS / USB signals
- IPC Class2 / Class3 high reliability available, DFM simulation on rigid-flex transition zone to release stress
- Prototype fast turn & mass OEM service, RoHS & REACH compliant for medical, wearable, aerospace & industrial camera
Specification Table
| Item | Specification |
|---|---|
| Structure | FR4 rigid section + Polyimide PI flex section, integrated laminated rigid-flex |
| Coverlay | PI coverlay (12.5μm / 25μm / 50μm), laser cut opening, acrylic / adhesive-free option |
| Copper Foil | RA rolled annealed copper; 0.33oz / 0.5oz / 1oz |
| Min Line / Space | 3mil / 3mil (0.075mm / 0.075mm) ultra-fine trace |
| Layer Count | 2L ~ 8L customizable |
| Flex Thickness | 0.1mm ~ 0.2mm |
| Rigid Thickness | 0.4mm ~ 1.6mm |
| Bend Radius | ≥0.5mm (depends on flex stack-up) |
| Dynamic Bending Life | ≥100,000 cycles (adhesive-free PI option) |
| Impedance Control | Single-ended / differential impedance, tolerance ±5%, ±8% |
| Surface Finish | Immersion Gold, Immersion Silver, OSP, Hard Gold |
| Standard | IPC-6013, IPC-2223, RoHS, REACH |
| Operating Temperature | -40℃ ~ +125℃ |
Performance Characteristics
- High-density wiring capability: Ultra-fine trace layout maximizes routing channels, perfect for compact miniaturized devices
- Superior mechanical bending reliability: PI coverlay has great ductility, avoids the cracking problem of liquid solder mask on repeated bending flex zone
- Stable high-speed signal performance: Continuous copper traces without intermediate connectors, reduce signal attenuation, crosstalk and reflection
- Stress release performance: Optimized routing at rigid-flex transition boundary, staggered traces to disperse bending stress, prevent trace fracture
- Good insulation & moisture resistance: Coverlay fully encapsulates copper circuit, effectively block dust, moisture and chemical erosion
- Low CTE matching: Matched CTE of PI and FR4 material, reduce delamination risk under repeated thermal cycling during SMT reflow
- Vibration resistance: All-in-one rigid-flex design removes board-to-board connectors, greatly lower loose contact failure rate in vibration environment
Manufacturing & Process Advantages
- LDI laser direct imaging process, guarantee ultra-fine trace width consistency and high layout precision
- Laser cutting for coverlay window, high registration accuracy, control adhesive squeeze-out strictly, prevent pad contamination
- Sequential lamination process for rigid-flex stack, uniform pressure and temperature, reduce void, delamination and warpage
- Professional stress relief process for rigid-flex boundary, FEA bending simulation in DFM stage to optimize layout
- Special RA copper etching technology, smooth copper surface, improve bending fatigue life of ultra-fine lines
- 100% AOI inspection for fine traces + electrical open/short test, cross-section analysis available for sampling audit
- Strict coverlay bonding quality control, test peel strength to avoid coverlay lifting after long-time bending
- Support microvia and HDI structure on rigid area, combine fine line routing to achieve higher integration
Typical Application Scenarios
- Medical wearable equipment, minimally invasive medical probe
- Foldable display module, notebook camera interconnection
- Aerospace and military portable control module
- Industrial inspection endoscope, mini test sensor
- High-speed signal transmission module with LVDS interface
- Compact consumer electronics and robotic joint interconnect
Company Brief
We specialize in custom rigid-flex PCB, FPC, HDI, high-frequency RF board and metal core MCPCB manufacturing.
We have mature production experience for ultra-fine trace, coverlay rigid-flex circuit, familiar with sequential lamination, laser coverlay opening and stress optimization technology.
We provide one-stop service including Gerber DFM review, prototype sampling, small batch and mass production. Our engineering team helps customers optimize rigid-flex transition layout to avoid bending fracture risk.
