Prototype Custom Fine Pitch BGA HDI PCB with Microvias

Prototype Custom Fine Pitch BGA HDI PCB with Microvias is a high-density interconnect circuit board built with laser drilled microvias, blind & buried vias and optional via-in-pad, specially engineered for fine-pitch BGA chips on compact high-speed electronics.

I. Key Benefits

✅ Laser microvia, blind & buried via structure, supports fine-pitch BGA layout, greatly improves routing density for compact chips
✅ Via-in-pad available, eliminates escape routing bottleneck under BGA, save board space for miniaturized design
✅ Ultra-fine line & space capability, suitable for high-speed differential signals with tight impedance tolerance
✅ Fast prototype service for engineering verification, short turnaround for R&D projects
✅ Stable dielectric material option for high-speed signal, low loss, low skew for DDR, PCIe, high-speed serial links
✅ Precise layer alignment and impedance control, reduce crosstalk and signal attenuation
✅ Stack-up customized according to your BGA pitch, signal requirement and thermal dissipation demand
✅ IPC-A-600 Class 2 / Class 3 available for industrial, medical and communication high-reliability applications

II. Specifications

III. Design Principle

This HDI PCB adopts a high-density interconnect stack-up designed specifically for fine-pitch BGA packages.

1. Traditional through-hole cannot escape traces underneath small-pitch BGA balls. Laser microvias directly connect pads to inner signal layers, solving the routing escape problem.
2. Via-in-pad technology puts microvias right under BGA solder pads, removing the need for fan-out traces around the pad, which is the core for 0.4/0.5mm ultra-fine pitch BGA.
3. The stack-up is arranged with reference planes adjacent to signal layers, to control impedance, shorten return path and suppress EMI.
4. High-speed differential pairs are routed with consistent gap and length matching to minimize skew and crosstalk.
5. Thermal vias array can be added under large BGA chips to improve heat dissipation and reduce junction temperature.
6. Layer sequence, dielectric thickness and copper weight are matched together to meet your impedance specification.

IV. Signal & Electrical Performance Features

1. Supports tight impedance control for single-ended and differential pairs: USB, PCIe, DDR, Ethernet and other high-speed interfaces.
2. Low Dk/Df high-speed substrate option reduces insertion loss at high frequency, maintains signal integrity.
3. Short microvia path provides low inductance, better than traditional mechanical drilled holes, good for high-speed chip interfaces.
4. Complete ground/power reference plane minimizes return path discontinuity and reduces crosstalk between adjacent traces.
5. Controlled trace length matching ensures timing requirement for memory and parallel bus signals.
6. DFM review before production: check BGA fan-out risk, impedance risk, voltage drop and thermal bottleneck for your layout.

V. Manufacturing & Process Advantages

1. UV laser drilling for microvias: high precision, small hole size, suitable for dense BGA area.
2. Sequential lamination process for blind and buried vias, accurate layer registration, less layer shift.
3. Special desmear process for laser microvias to guarantee reliable copper plating inside tiny vias, prevent open circuit.
4. Advanced AOI + AXI inspection, especially for hidden microvia and via-in-pad quality checking.
5. Strict impedance testing with TDR upon request for high-speed boards.
6. Mature prototype workflow, fast sampling for engineering test, support design revision iteration.
7. Stable registration control, avoid BGA pad shift issue which causes soldering short or open.

VI. Application Scenarios

• High-speed industrial control mainboard
• Image processing & video capture board
• Communication RF and signal processing modules
• Portable high-performance detection equipment
• Medical imaging control PCB
• AI edge computing mini carrier board
• High-density FPGA & SoC carrier board