Volectronics manufactures Rogers 4003C High Frequency PCB with Controlled Impedance, engineered for RF, microwave, and high-speed digital applications where signal integrity and stable impedance are essential.
Built on Rogers RO4003C hydrocarbon/ceramic laminate, these boards combine a stable dielectric constant (Dk 3.38 ±0.05) with a low dissipation factor (Df 0.0027 at 10 GHz), delivering low insertion loss, low return loss, and reliable phase consistency for antennas, power amplifiers, filters, and RF front-end modules.
Key Specifications
| Item | Typical Value |
|---|---|
| Material Type | Rogers RO4003C (Hydrocarbon/Ceramic) |
| Dielectric Constant Dk | 3.38 ±0.05 (10 GHz) |
| Dissipation Factor Df | 0.0027 (10 GHz) |
| Frequency Range | DC ~ 10 GHz+ |
| Layers | 2–12 (Hybrid with FR4 possible) |
| Impedance Control | 50/100Ω, ±5–10% |
| Min Trace/Space | 4/4–3/3 mil |
| Copper Thickness | 1 oz (HVLP optional) |
| Board Thickness | 0.8–2.4 mm |
| Surface Finish | ENIG / Immersion Tin / OSP |
| Water Absorption | ≤0.05% |
| CTE | Low, dimensionally stable |
| Operating Temp. | −55 ~ +150°C |
| Flame Rating | UL 94V-0, Halogen-Free |
Precision Impedance Control
The defining feature of this Rogers 4003C High Frequency PCB is its precise impedance control of 50Ω and 100Ω (±5–10%). Through careful stack-up design, controlled trace widths, and complete reference planes, every board achieves consistent characteristic impedance for clean signal transmission and minimal reflection. Differential pairs are designed with matched length and impedance (100Ω) for stable high-speed performance.
Low-Loss, High-Frequency Performance
RO4003C offers a low dissipation factor of 0.0027, ensuring minimal signal attenuation across the operating range from DC up to 10 GHz and beyond. The tightly controlled dielectric constant (±0.05) provides consistent impedance and low return loss across the board and between production batches, making this Rogers 4003C High Frequency PCB well suited for phased-array antennas and beamforming systems where phase consistency is critical.
Hybrid Lamination Option
To balance performance and cost, we offer hybrid lamination that combines Rogers high-frequency layers for critical RF circuitry with standard FR4 inner layers for power and control signals. This approach preserves the radio-frequency performance of the Rogers 4003C High Frequency PCB while significantly reducing material cost for multi-layer designs. Hybrid boards are available in 2 to 12 layers.
Manufacturing Quality
Every board is produced with precise impedance verification, tight etching tolerances, and comprehensive quality control including impedance testing, AOI inspection, and dimensional checks. Low-profile HVLP copper foil is available to minimize conductor roughness losses, while controlled fiberglass weave effects stabilize the dielectric constant and phase. The surface finish — ENIG, immersion tin, or OSP — ensures excellent solderability and long shelf life. All boards are rated UL 94V-0 and halogen-free.
Typical Applications
- Communication base stations and antennas
- Power amplifiers (PA) and RF front-end modules
- Filters, duplexers, and combiners
- Radar systems and RF identification
- Test and measurement instruments
