Our Yellow Solder Mask High Frequency PCB, RF Power Amplifier Board is built with low-loss dielectric material and optional RF mask relief window for high-power microwave amplifier applications.
Core Selling Points
🟢 Custom yellow LPI solder mask, high copper trace contrast, easier visual debugging & AOI inspection for RF power amplifier prototype
🟢 Low-loss Rogers / Taconic / PTFE substrate, optimized for high-power RF PA, reduce insertion loss and heat accumulation
🟢 Support mask relief opening on critical RF transmission traces, eliminate extra dielectric loss caused by solder mask
🟢 Precise 50Ω / 75Ω impedance control, stable matching network for LDMOS & GaN power amplifier circuits
🟢 Heavy copper option (2oz~4oz) available for high current and thermal dissipation of power stage
🟢 Strict control of solder mask thickness, uniform coating, no bubble or offset on RF matching area
🟢 Prototype and small batch fast turn, DFM review for RF matching, grounding and thermal design
🟢 IPC Class2 / Class3 optional, RoHS & REACH compliant, widely used for 5G, radio, radar PA module
Specification Table
| Item | Specification |
|---|---|
| Solder Mask | Yellow LPI liquid photoimageable solder mask; mask relief on RF traces optional |
| Base Material | Rogers RO4003C / RO4350B / RO5880, Taconic, PTFE ceramic filled material |
| Layer | 2L, 4L, 6L, hybrid stackup (Rogers + FR4) |
| Copper Foil | Low profile copper / RTF copper; 1oz / 2oz / 3oz / 4oz heavy copper for power circuit |
| Dk / Df | Dk:2.2~3.66; Df:0.0009~0.003 @10GHz |
| Impedance | 50Ω,75Ω, differential impedance, tolerance ±5% / ±8% |
| Min Line/Space | 3mil / 3mil |
| Board Thickness | 0.508mm ~ 3.175mm custom |
| Surface Finish | Immersion Gold, Immersion Silver, Hard Gold, Bare Copper (RF window area) |
| Operating Frequency | Up to 28GHz, suitable for UHF, VHF, microwave power amplifier |
| Working Temp | -40℃ ~ +125℃ |
| Standard | IPC-6012, RoHS, REACH |
Performance Characteristics
- Excellent RF low-loss performance: Low-loss dielectric material minimizes signal attenuation under high transmit power, maintain PA output efficiency
- Superior thermal stability: Low CTE substrate, prevent via crack and delamination under continuous high-power heating
- Clear yellow solder mask contrast: Copper traces, pads and matching lines are easy to identify, convenient for engineer debugging, repair and AOI inspection
- Controllable solder mask influence: We can remove solder mask over RF microstrip lines on request, avoid impedance drift and extra dielectric loss
- High current carrying capability: Heavy copper design reduces temperature rise of power amplifier drain circuit
- Good grounding performance: Compact ground via array design, low ground inductance, suppress self-oscillation of RF power amplifier
- Low moisture absorption: Stable electrical performance in outdoor and humid communication equipment environment
Manufacturing & Process Advantages
- Professional yellow LPI solder mask process, control mask thickness evenly, avoid thin mask or over-coating on RF traces
- Special mask relief process: precisely open window on critical RF transmission lines, compatible with microwave high-frequency design
- Precision lamination for low-loss RF material, strictly control layer thickness tolerance, guarantee impedance consistency
- Low-profile copper etching process, smooth trace surface, reduce conductor loss for high-power RF signal
- 100% electrical open/short test + TDR impedance test, provide test report on demand
- DFM pre-check for RF PA layout: check grounding, via placement, thermal path, matching line width to avoid oscillation risk
- Support bare copper + ENIG selective surface finish for RF window area
- Yellow mask batch stability control, no color difference, suitable for prototype identification and project version distinction
Typical Application Scenarios
- 5G remote radio RF power amplifier module
- LDMOS, GaN microwave power amplifier board
- Two-way radio, broadcast transmitter power circuit
- Radar transceiver power amplification unit
- RF test instrument, signal source power stage
- Industrial wireless communication, ISM band high-power transmission
Company Brief
We are a specialized PCB manufacturer focusing on custom high-frequency RF PCB, HDI, rigid-flex, FPC and MCPCB.
We accumulate rich experience in RF power amplifier, antenna and millimeter-wave circuit fabrication. We provide full DFM review, Gerber stack-up consultation, prototype sampling, small batch and mass production service.
Our technical team is familiar with Rogers, Taconic, PTFE low-loss material process and RF impedance control. All products follow IPC, RoHS and REACH standards, serve global customers in communication, radar, medical and industrial electronics.
