High Frequency PCB like this TP-2 8-Layer microwave board provides stable dielectric constant and ultra-low signal loss for RF and microwave systems.
Key Specifications
| Item | Typical Value |
|---|---|
| Material Type | PTFE / Carbon-Ceramic high-frequency laminate (TP-2) |
| Layers | 8 layers |
| Dielectric Constant Dk | ~2.2–3.0 (±0.05) |
| Dissipation Factor Df | 0.0009–0.002 |
| Frequency Range | DC ~ 40 GHz+ |
| Copper Thickness | 1 oz (HVLP low-roughness optional) |
| Min Trace/Space | 3/3–2/2 mil |
| Impedance Control | 50Ω, ±5% |
| Surface Finish | Immersion Gold (ENIG) |
| Water Absorption | ≤0.06% |
| CTE | Low, dimensionally stable |
| Flame Rating | UL 94V-0 |
| Operating Temp. | −55 ~ +150°C |
Manufacturing Advantages
- Ultra-low loss: Df 0.0009–0.002; minimal microwave signal attenuation.
- Stable Dk: ±0.05; ensures consistent impedance and low signal reflection.
- 8-layer hybrid construction: Combines high-frequency layers with standard inner layers to balance performance and cost.
- Low-roughness copper foil (HVLP): Reduces conductor loss; critical for millimeter-wave applications.
- Fiber weave effect control: Spread-glass or homogenized weave; ensures excellent phase consistency.
- ENIG (Electroless Nickel/Immersion Gold) finish: Flat and coplanar surface; facilitates fine-pitch assembly and ensures good solderability.
- Dimensional stability: Low CTE; resistant to thermal deformation.
Signal & Electrical Performance
- Low insertion loss: Minimal attenuation for high-power/long-distance microwave transmission.
- Low return loss: Precision 50Ω matching with minimal signal reflection.
- Phase consistency: Suitable for phased array and beamforming applications.
- High-frequency capability: Covers DC to 40GHz+; ideal for radar, satellite, and 5G mmWave systems.
- Low dielectric loss: Ensures high signal integrity and supports high-speed RF links.
- Low water absorption: Excellent environmental adaptability and stable performance parameters.
Volectronics Tech Co., Ltd is a one-stop service provider for PCB and PCBA manufacturing, covering the entire production chain under one roof — from PCB design and fabrication to component sourcing, assembly, and functional testing.
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